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STTH810
Ultrafast recovery - high voltage diode
Main product characteristics
IF(AV) VRRM Tj VF (typ) trr (typ) 8A 1000 V 175 C 1.30 V 47 ns
A
K
A K TO-220AC STTH810D K TO-220FPAC STTH810FP
A
Features and benefits

Ultrafast, soft recovery Very low conduction and switching losses High frequency and/or high pulsed current operation High reverse voltage capability High junction temperature Insulated packages: - TO-220Ins - Electrical insulation = 2500 VRMS Capacitance = 7 pF - TO-220FPAC Electrical insulation = 2500 VRMS Capacitance = 12 pF
K A NC K
A
D2PAK STTH810G
TO-220Ins STTH810DI
Description
The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. Such demanding applications include industrial power supplies, motor control, and similar mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device.
Order codes
Part Number STTH810D STTH810G STTH810G-TR STTH810FP STTH810DI Marking STTH810D STTH810G STTH810G STTH810FP STTH810DI
March 2006
Rev 1
1/11
www.st.com 11
Characteristics
STTH810
1
Table 1.
Symbol VRRM IF(RMS)
Characteristics
Absolute ratings (limiting values at 25 C, unless otherwise specified)
Parameter Repetitive peak reverse voltage TO-220AC / D PAK / TO-220FPAC RMS forward current TO-220AC Ins TO-220AC / D2PAK IF(AV) Average forward current, = 0.5 TO-220FPAC TO-220AC Ins IFRM IFSM Tstg Tj Repetitive peak forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Tc = 130 C Tc = 75 C Tc = 105 C 100 60 -65 to + 175 175 A A C C 8 A 20
2
Value 1000 30
Unit V A
tp = 5 s, F = 5 kHz square tp = 10 ms Sinusoidal
Table 2.
Symbol
Thermal parameters
Parameter TO-220AC / D
2PAK
Value 2.5 5.8 4.1
Unit
Rth(j-c)
Junction to case
TO-220FPAC TO-220AC Ins
C/W
Table 3.
Symbol IR(1)
Static electrical characteristics
Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Tj = 25 C VR = VRRM Min. Typ Max. 5 A 2 20 2 IF = 8 A 1.4 1.3 1.8 1.7 V Unit
VF
(2)
Forward voltage drop
Tj = 100 C Tj = 150 C
1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 %
To evaluate the conduction losses use the following equation: P = 1.3 x IF(AV) + 0.05 IF2(RMS)
2/11
STTH810 Table 4.
Symbol
Characteristics Dynamic characteristics
Parameter Test conditions IF = 1 A, dIF/dt = -50 A/s, VR = 30 V, Tj = 25 C IF = 1 A, dIF/dt = -100 A/s, VR = 30 V, Tj = 25 C Reverse recovery current Softness factor Forward recovery time Forward recovery voltage IF = 8 A, dIF/dt = -200 A/s, VR = 600 V, Tj = 125 C IF = 8 A, dIF/dt = -200 A/s, VR = 600 V, Tj = 125 C dIF/dt = 50 A/s IF = 8 A VFR = 1.5 x VFmax, Tj = 25 C IF = 8 A, dIF/dt = 50 A/s, Tj = 25 C 5.5 Min. Typ 64 47 12 2 300 ns V Max. 85 ns 65 16 A Unit
trr
Reverse recovery time
IRM S tfr VFP
Figure 1.
P(W)
18
Conduction losses versus average current
=0.05 =0.1 =0.2 =0.5 =1
Figure 2.
IFM(A)
80 70 60 50
Forward voltage drop versus forward current
16 14 12 10 8 6 4 2 0 0 1 2 3 4 5 6 7 8 9 10
T
Tj=150C (Maximum values)
Tj=150C (Typical values) Tj=25C (Maximum values)
40 30 20 10 0 0.0
IF(AV)(A)
VFM(V)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 3.
Relative variation of thermal impedance junction to case versus pulse duration
Figure 4.
Relative variation of thermal impedance junction to case versus pulse duration
Zth(j-c)/Rth(j-c)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03
Single pulse DO-220AB DPAK
Zth(j-c)/Rth(j-c)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2
Single pulse TO-220FPAB
tp(s)
1.E-02 1.E-01 1.E+00
0.1 0.0 1.E-03 1.E-02 1.E-01
tp(s)
1.E+00 1.E+01
3/11
Characteristics
STTH810
Figure 5.
IRM(A)
25
VR=600V Tj=125C
Peak reverse recovery current versus dIF/dt (typical values)
IF= 2 x IF(AV)
Figure 6.
trr(ns)
500 450 400
Reverse recovery time versus dIF/dt (typical values)
VR=600V Tj=125C IF= 2 x IF(AV)
20
IF= IF(AV)
350 300
IF= IF(AV)
15
IF=0.5 x IF(AV)
250 200 150
10
5
100
IF=0.5 x IF(AV)
dIF/dt(A/s)
0 0 50 100 150 200 250 300 350 400 450 500
50 0 0 50 100
dIF/dt(A/s)
150 200 250 300 350 400 450 500
Figure 7.
Qrr(C)
2.5
VR=600V Tj=125C
Reverse recovery charges versus dIF/dt (typical values)
Figure 8.
S factor
3.0
Softness factor versus dIF/dt (typical values)
IF = 2 x IF(AV) VR=600V Tj=125C
IF= 2 x IF(AV)
2.0
2.5
IF= IF(AV)
1.5
2.0
1.0
IF=0.5 x IF(AV)
1.5
0.5
0.0 0 50 100 150 200
dIF/dt(A/s)
250 300 350 400 450 500
dIF/dt(A/s)
1.0 0 50 100 150 200 250 300 350 400 450 500
Figure 9.
Relative variations of dynamic parameters versus junction temperature
Figure 10. Transient peak forward voltage versus dIF/dt (typical values)
VFP(V)
45
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 25
QRR IRM Sfactor IF = IF(AV) VR=600V Reference: Tj=125C
40 35 30 25 20 15
IF = IF(AV) Tj=125C
tRR
10
Tj(C)
75 100 125
5 0 0 100 200
dIF/dt(A/s)
300 400 500
50
4/11
STTH810
Characteristics
Figure 11. Forward recovery time versus dIF/dt Figure 12. Junction capacitance versus (typical values) reverse voltage applied (typical values)
tfr(ns)
600 550 500 450 400 350 300 250 200 0 100
IF = IF(AV) VFR = 1.5 x V F max. Tj=125C
C(pF)
100
F=1MHz Vosc=30mVRMS Tj=25C
10
dIF/dt(A/s)
200 300 400 500
VR(V)
1 1 10 100 1000
Figure 13. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, ecu = 35 m)
Rth(j-a)(C/W)
80
DPAK
70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 35 40
SCU(cm)
5/11
Package information
STTH810
2
Package information
Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm (TO-220AC, TC-220Ins, TO-220FPAC) Maximum torque value: 0.7 Nm (TO-220AC, TO-220Ins, TO-220FPAC) Table 5. T0-220AC dimensions
DIMENSIONS REF. Millimeters Min. A
H2 OI L5 L7 L6 L2 C A
Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409
Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40
4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00
C D E F F1 G
F1
L9 L4 F
D
H2 L2
M E
16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93
0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154
L4 L5 L6 L7 L9 M Diam. I
G
2.6 typ. 3.75 3.85
0.102 typ. 0.147 0.151
6/11
STTH810 Table 6. T0-220Ins dimensions
Package information
DIMENSIONS REF Millimeters Min. A a1 a2 B b1 b2 C c1 c2 e F OI I4 L l2 M 13.00 10.00 0.61 1.23 4.40 0.49 2.40 4.80 6.20 3.75 15.20 3.75 14.00 0.511 10.40 0.393 0.88 1.32 4.60 0.70 2.72 5.40 6.60 3.85 0.024 0.048 0.173 0.019 0.094 0.189 0.244 0.147 Max. Min. Inches Max. 0.625 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.212 0.259 0.151
15.90 0.598
15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 2.60 2.95 1.70 0.104 0.044 0.102 0.116 0.066
7/11
Package information Table 7. T0-220FPAC dimensions
DIMENSIONS REF Millimeters Min. A
A H B
STTH810
Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409
Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4
4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10
B D
Dia L6 L2 L3 L5 F1 L4 D L7
E F F1 G G1 H L2
16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20
0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126
F G1 G
E
L3 L4 L5 L6 L7 Dia.
8/11
STTH810 Table 8. D2PAK dimensions
Package information
DIMENSIONS REF. Millimeters Min. A
A E L2 C2
Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126
Max 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20
4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40
A1 A2 B
D
B2 C
L L3 A1 B2 B G A2 2mm min. FLAT ZONE R
C2
C
D E G L
V2
L2 L3 M R V2
0.40 typ. 0 8
0.016 typ. 0 8
Figure 14. D2PAK footprint (all dimensions in mm)
16.90
10.30 1.30
5.08
8.90
3.70
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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Ordering information
STTH810
3
Ordering information
Part Number STTH810D STTH810DI STTH810FP STTH810G STTH810G-TR Marking STTH810D STTH810DI STTH810FP STTH810G STTH810G Package TO-220AC TO-220Ins TO-220FPAC D2 D2 PAK PAK Weight 1.86 g 1.86 g 2.2 g 1.48 g 1.48 g Base qty 50 50 50 50 1000 Delivery mode Tube Tube Tube Tube Tape & reel
4
Revision history
Date 02-Mar-2006 Revision 1 First issue. Description of Changes
10/11
STTH810
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